25

Electronic materials process modeling

Year:
1996
Language:
english
File:
PDF, 999 KB
english, 1996
27

A FEM/VOF hybrid formulation for underfill encapsulation modeling

Year:
2003
Language:
english
File:
PDF, 344 KB
english, 2003
28

Chemical tuning of band alignments for Cu/HfO2 interfaces

Year:
2015
Language:
english
File:
PDF, 1.24 MB
english, 2015